Dual Monitor Module FlexDSX Panel
Backplane interfaces available: Wire-Wrap, BNC and RJ-45
1. DSX SME1/T1 is a centralized termination point.
2. Easy maintenance.
3. High capacity.
4. Reduce initial set up cost.
5. Wire Wrap Type, BNC, RJ45 Jack are available
The DSX-SME1/T1 panel is a centralized termination point for digital equipment at DS1 (1.544Mbps) and E1 (2.048Mbps) digital signal bit rate. It provides SDH (Synchronous Digital Hierarchy)networks STM-N(N=1/4/16) terminal equipments, the circuit jumping, cross-connecting, monitoring & testing access functions for the above digital signal bit rate.
It is Modular design, it is capable of high desity installation. Each circuit in the DSX-SMT1/E1 panel is independence for choose the capacity as needed to reduce the initial set-up cost, and for easy maintenance the independent circuit module can be replaced separately. The panel in 19” wide rack consists of 64 circuits module in the sub chassis.
Single-circuit removable DSX-SME1 Jacks allow jack maintenance without disrupting other circuits or requiring any I/O cabling changes.
1.1 Temperature : -40~65°C, Humidity : 0~95% RH
1.2 Thermal Shock : per MIL-STD-202 method 107D or equivalent.
1.3 Moisture Resistance: per MIL-STD-202F method 106E or equivalent.
1.4 Salt Spray : per MIL-STD-202F method 101D or equivalent.
2 Mechanical Characteristic
2.1 Vibration: per MIL-STD-202F method 201A or equivalent.
2.2 Shock Test : per MIL-STD-202 method 107D or equivalent.
2.3 Life Time: 20,000 insertion/withdrawal cycles.
2.4 Insertion Force: 1.9kgs.(4.17lb.)
2.5 Withdrawal Force: 2.4kgs.(5.21lb.)
3 Electrical Characteristic
E1:120 Ω ± 5% ( @ 1024KHz ).
T1:100 Ω ± 5% ( @ 772KHz).
3.2 Insertion Loss : Better than 0.2dB(DC to 3MHz).
3.3 Monitor Level: below signal level 20dB±0.5dB (DC to 3MHz).
3.4 Cross Talk : better than –56dB (@1.024Mhz).
4.5 Contact Resistance: less than 0.01 Ω.
4.6 Insulation Resistance: more than 1,000MΩ at DC 500V.
4.7 Dielectric Strength : better than DC 500V
4.8 Power consumption: -48V DC, 10mA maximum on each circuit module.